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PACKAGE LAYOUT DESIGNER


Source:
TIMESJOBS.COM
Location:
Bengaluru, KA
Date:
10-11-2016
Job Code:
58245398
Categories:
  • IT
Applying for this job will take you to an external site
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Job Details

Requirements Should have experience in Flip Chip & Wirebond Package designs Good knowledge on different Package technologies for both FC & WB Good hold on DFM on Substrate front High Speed Interfaces Exposure HDI, Blind/Buried via technology Exposure Responsibilities Conduct package routing feasibility & layouts for FC and WB designs Creating & understanding bumpout and ballout Creating BGA footprints & Die symbols IO & PD routing Design checklist & review consideration Manufacturing & Test files generation Design Documentation Individual Contributor Ability
Additional Degree: BE/ B.Tech (Engineering)

Experience: 2-3

Requirements

Hardware Design | RF Engineering
Applying for this job will take you to an external site

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